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μ PG2185T6R
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
IR260
<R>
Partial Heating
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Peak temperature (terminal temperature) : 350 ° C or below
HS350
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0053EJ0300 Rev.3.00
Nov 22, 2012
Page 8 of 9
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